我们有各类优质途径解决材料问题,常备国际知名品牌原材料,能满足各类产品需求,常备材料如下:
常规板料:
高频材料:
工艺能力
Capability of Rigid board
No.
Type
Standard
1
Normal FR4/Halogen free/ High Tg FR4/ Aluminum
KB,Shengyi, ITEQ,Isola, Nelco,Ventec,Tuc,Elite, Panasonic, Getek,NanYa, Bergquist,laird
2
PTFE Laminates
Rogers series、Taconic series、 Arlon series、Nelco series、 Taizhou Wangling F4BK series、TP series;
3
Hybrid laminating
Rogers/Taconic/Arlon/Nelco laminate with FR-4 material - including partial Ro4350B hybrid laminating with FR-4
4
Multilayers
4-64 layers, board thickness 0.4mm-10mm
5
Buried/Blind Via
4-50 layers, board thickness 0.5mm-10mm
6
HDI
1+N+1、2+N+2、 3+N+3、Anylayer HDI
7
Flex & Rigid-Flex PCB
1-12layers Flex PCB ,2-20layers Rigid-flex PCB HDI+Rigid-flex PCB
8
Soldermask Type(LPI)/ Soldermask color
kuangshun,Taiyo、 Himonia,Nanya,Onstatic, Chung Yu,MSDS/Green, Yellow, Black, Blue, Red, White,Purple,Orange , Matte Green,Matte Blue, Matte Black
9
Peelable Soldermask/color
PETER SD2955/Blue-Green
10
Carbon ink
Nipon
11
HASL/Lead Free HASL
Thickness: 0.5-40um
12
OSP
Entek Plus HT, Preflux F2 LX
13
ENIG (Ni-Au)
Au:0.03um≤max<0.06um Ni:3um≤max≤6um
14
Electro-bondable Ni-Au
Au:0.2-1.0um Ni:2.54-10um
15
ENEIPG
Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm
16
Electro. Hard Gold
Au:5~50uin(0.125~1.27um); Nithickness:100~250uin (2.50~6.25um)
17
Thick tin
1.0-1.4um
18
Copper thickness
12oz max.
19
Min Mechanical Drill Hole
0.15mm
20
Min. Laser Drill Hole
4mil (0.100mm)
21
Line Width/Spacing
2mil/2mil
22
Max. Panel Size
650mm X 1200mm
23
Line Width/ Spacing Tolerance
Non electro coating:+/-5um, Electro coating:+/-10um
24
PTH Hole Tolerance
+/-0.002inch(0.050mm)
25
NPTH Hole Tolerance
26
Hole Location Tolerance
27
Hole to Edge Tolerance
+/-0.004inch(0.100mm)
28
Edge to Edge Tolerance
29
Layer to Layer Tolerance
+/-0.003inch(0.075mm)
30
Impedance Tolerance
+/- 10% /Max >50ohm +/- 5%
31
Warpage %
Max ≤0.5%
Capability of Rigid-flex board
NO.
Item
1-30layers Flex PCB , 2-20layers Rigid-flex PCB HDI+ Rigid-flex PCB
FCCL(adhesive)
Shengyi SF305:PI= 0.5mil&1mil&2mil; Cu=0.33oz&0.5oz&1oz
FCCL(adhesiveless)
Panasonic R‐F775(ER): PI=1mil&2mill; Cu=0.33oz&0.5oz &1oz
DuPont Pyralux AP:PI=1mil&2mil&3mil; Cu= 0.5oz&1oz
Coverlay
Shengyi SF305C: 0515& 0525&1025&2030
Taiflex FHK: 1025&1035
Adhesive
Taiflex BT: AD=10um& 25um& 40um
shengyi SF302B: AD=35um&40um
PI stiffener
Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil
3M
9077&6677&9458
NO FLOW PP
Ventec:VT‐47N(TG 170℃)& EM‐285B(TG 150℃)
CCL
ITEQ: IT‐180A; Shengyi: S1141& S1000‐2
Other CCL
Arlon: 85N; Rogers: RO4000 series; Nelco:N4000‐13 series, Ventec:VT‐901
Board thickness
0.3mm‐3.0mm
Tolerance of board thickness (thickness>1.0mm)
±10%
Tolerance of board thickness (thickness≤1.0mm)
±0.1mm
Min. board size
10mm*15mm
Max. board size
406.4mm*558.8mm
Impedance control tolerance
Bow&twist
0.75%(symmetrical), 2%(unsymmetrical)
Min. BGA pad size
12mil(8mil for electrical soft gold board)
Max. finished copper thickness
3oz
Max. buried via
0.4mm
Tolerance of non‐plated holes
±2mil(limited is +0/‐ 2mil or +2/‐0mil)
Solder mask color
green,blue,red, matte green,
Min. solder dam (copper≤1oz)
4mil(green, red and blue), 5mil(black and white)
Min. solder dam (copper2‐4oz)
8mil
Min. clearance
2.5mil (2.0mil)
Surface treatment
HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold,Hard Gold, Immersion silver, Immersion tin and OSP
Thickness (ENIG)
0.05‐0.10um
Nickel thickness (ENIG)
3‐8um
Gold thickness (ENEPIG)
Palladium thickness (ENEPIG)
0.05‐0.15um
Nickel thickness (ENEPIG)
Hard gold thickness (leadless)
0.1‐1.5um
Hard gold thickness (including lead)
0.1‐4.0um
Electrolytic Nickel thickness
≥3um
Electrolytic Gold thickness
Immersion silver thickness
0.2‐0.4um
OSP thickness
0.1‐0.3um
32
Tolerance of board outline
±6mil(exclude complicated board outline and cutout)